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1. Kudiwa Kunokosha kubva kuAI Servers neData Centers

Maseva eAI anomiririra sosi huru yekuwedzera kwekuda kwejira regirazi refaibha risina dielectric rakadereraMaitiro ekudzidzisa nekufungidzira nezveAI anotsigira kuchinjana kukuru kwedata, zvichiita kuti pave nekushandiswa kwemaPCB ane ma layer-count uye matekinoroji ekubatanidza anomhanya nekukurumidza; izvi zvinoisa kudiwa kwakanyanya pahunhu hwe dielectric uye kugadzikana kwezvinhu. Nekushandiswa kwematekinoroji akadai sePCIe 6.0 ne224G optical modules, zvinodiwa pakushanda kwema laminates e copper-clad (CCL) mumaseva eAI zvakachinja kubva pa standard low-loss kuenda ku ultra-low-loss (ULL) uye hyper-low-loss (HLL), zvichikonzera kuwedzera kwekudiwa kwema grade anoenderana e low-dielectric glass fiber cloth. Data remusika rinoratidza kuti kukosha kweCCL mumaseva eAI kwakapetwa ka5 kusvika ka8 pane kwemaseva echinyakare. Sechinhu chakakosha, jira regirazi re low-dielectric low-end rakaona mutengo waro uchisvika 320,000–350,000 RMB/ton muna 2025—kuwedzera kwe20% kubva pakutanga kwegore—nemamwe mamodheru akasangana nemitengo yakakwira inosvika 250%–300%.

Nezve mukaha wekudiwa kwezvinhu, zvichikonzerwa nekuwanda kuri kuramba kuchikwira kwezvinodiwa nevatengi veAI vari pasi uye zvipingamupinyi pakukwanisa kugadzira machira emagetsi epamusoro-soro, huwandu hwemachira emagetsi epamusoro-soro muvagadziri vakuru veCCL hwaderera kusvika pasi pevhiki imwe chete, zvichiratidza kudzikira kwenhoroondo. Kuti vagutse kudiwa kwezvinhu zvepamusoro-soro, vagadziri veCCL vakamanikidzwa kukwidza mitengo yekutenga. Zvichienderana nemitengo iripo uye mamiriro ezvinhu ari kudiwa, machira egirazi epamusoro-soro akagadzirira kuona kuwedzera kwehuwandu nemutengo panguva imwe chete.

2. Zvinodiwa pakushanda kweHigh-End Chip Packaging

Tekinoroji yepamusoro yekurongedza machipisi eAI inomiririra imwe mamiriro akakosha ekushandisajira regirazi refaibha risina dielectric rakaderera. Sezvo maitiro ekugadzira machipisi achifambira mberi kusvika pa3nm node zvichienda mberi, huwandu hwemapakeji hunoramba huchikwira. ABF substrates—vatakuri vakakosha vanobatanidza machipisi kuPCB—vanoda zvakanyanya pahunhu hwe dielectric uye kuchena kwezvinhu zvavo zvekutanga. Kazhinji, dielectric constant inofanira kuwira mukati me3.0–4.0 range (pa1 MHz), zvichienderana nefrequency yekushanda, nepo dissipation factor (Df) ichifanirwa kudzorwa pakati pe0.005 ne0.010 (pa1 MHz); mashandisirwo e high-frequency (akadai se5G uye high-speed communications) anogona kuda kunyange mitengo yakaderera (<0.005). Uyezve, kuti zvigutse zvinodiwa zvekurongedza zvakanyanya, zvinhu zvinofanirwa kuyera Coefficient of Thermal Expansion (CTE) yakaderera nekupisa kwakanyanya kudzivirira kuputika kwedunhu kunokonzerwa nekushushikana kwekupisa. Jira reQuartz fiber (rinozivikanwawo se "Q-fabric" kana "jira remagetsi rechizvarwa chechitatu") rave chinhu chinodiwa kune ABF substrates nekuda kwekusagadzikana kwayo kwe dielectric (2.2–2.3), kurasikirwa kushoma kwe dielectric (Df ye 0.001–0.0005), uye kugona kutsungirira tembiricha yekushanda kwenguva refu ye600°C kana kupfuura.

Kukura nekukurumidza kwekutumira machipisi eAI pasi rose kuri kukonzera kuwedzera kwekudiwa kwemachira equartz. Sekureva kwezvakafanotaurwa neFuture Think Tank, musika wepasi rose wemachira equartz unotarisirwa kusvika mabhiriyoni emadhora $3.127 panosvika 2031, nekukura kwegore negore (CAGR) kwe23.30%. Iyi fungidziro inoratidza kuwedzera kwekuda, kunoenderana nekukwira kuri kuramba kuchiitika kwekutumirwa kwemachipisi eAI uye kushandiswa kwakapararira kwetekinoroji yepamusoro yekurongedza. Uyezve, kugadzirwa kwemapuratifomu eAI echizvarwa chinotevera—akadai se“Rubin”—anoenderana nemaitiro ekugadzira machipisi e3nm kana N4 uye anoshandisa CoWoS-L ultra-large substrate packaging. Aya mapuratifomu anobatanidza maHBM4 stacks masere kuti asangane nezvinodiwa zvebandwidth yakakwira uye kubatana, zvichipa mhinduro yakakwana yekuwedzera simba remakomputa. Zvinodiwa zvema substrates makuru uye kushanda kwakanyanya zvichawedzera kudiwa kwezvinhu zvemachira equartz, zvichitungamira kushanduka kwemachira egirazi eLow-Dk (low dielectric constant) kusvika kune machira e dielectric akaderera uye maitiro ekurasikirwa akaderera.

3. Kukura Kwevanhu Vakabatana Muzvikamu Zvakasiyana-siyana

Kupfuura chikamu chikuru chesimba reAI computing, kudiwa kubva kuminda yakaita se5G/6G communications uye ma electronics epamusoro evatengi kuri kukurudzira kukura kwe synergistic pamwe chete neAI. Kushanduka kubva pa 5G millimeter-wave (24–100 GHz) kuenda ku 6G terahertz technology (frequency range inosvika 100 GHz–3 THz) kunosanganisira ma frequency akakwira anoita kuti michina yekutaurirana ive nehanya zvakanyanya nekurasikirwa nesignal. Kunyange zvazvo nguva ye 5G yaida jira re fiberglass rakanyanya kurasikirwa, nguva ye 6G inoisa zvinodiwa zvakanyanya zve dielectric constant (Dk) uye dissipation factor (Df): Dk inofanira kuderera kusvika pa 2.0–3.0 (pa >100 GHz), uye Df inofanira kuderera kubva pa 5G standard ye 0.003–0.005 (pa 10 GHz) kusvika pa 0.0001–0.0007 (pa 100 GHz), zvichiita kuti pave ne "low-loss" quartz cloth. Muchikamu chemagetsi evatengi, iPhone 17 yakashandisa jira re low-CTE (coefficient of thermal expansion) uye jira re low-dielectric rinopihwa neHonghe Technology kugadzirisa matambudziko akadai sekusonera chip yeA10 Pro 3nm, kudzivirira kuchinjika mumabhodhi e motherboard ane density yakakura, uye kuderedza kurasikirwa kwesimba mumasaini e 5G/Wi-Fi 7 ane frequency yakakwira. Kufamba uku kunoratidza kushanduka nekukurumidza kwemachira emagetsi epamusoro kubva kumashandisirwo emaindasitiri kuenda kuma electronics evatengi, zvichikonzera kuwedzera kwekudiwa kwezvinhu uye kuwedzera nguva yekutumira. Kuvandudzwa kwakangwara kwemagetsi emotokari kuri kubatsirawo mukuwedzera kudiwa; kutyaira kwe autonomous kwepamberi (Level 3 zvichikwira) kunoda masensa akawanda eADAS uye ma radar ane frequency yakakwira. Masisitimu aya anoda kugadzikana kwekutumira masaini, kuvimbika kwenguva refu kwe solder joints, uye kusimba kwe automotive-grade kurwisa vibration, kupisa, uye hunyoro. Nekuda kweizvozvo, zvinhu zve circuit board zvine low dielectric constants, low dielectric loss, CAF (conductive anodic filament) resistance, uye low CTE zvave sarudzo inofarirwa ye advanced intelligent driving systems, zvichiwedzera kukurumidza kushandiswa kwe high-end fiberglass jira. Kufanotaura kwemaindasitiri kunoratidza kuti musika wepasi rose wezvinhu zvemagetsi zvisingashandise magetsi akawanda unogona kusvika mabhiriyoni 3.76 eyuan panosvika gore ra2031, zvichikura pamwero wepagore we10.1% - mafambiro anokonzerwa nekubatana kwezvinodiwa muzvikamu zvakasiyana.

Muganho mukuru wekuwedzera kwesimba remakombiyuta uri mukupfuura nemumiganhu yezvinhu. Kubva kumaPCB ane kurasikirwa kwakanyanya anoshandiswa mumasevha eAI nejira requartz mumapakeji epamusoro kusvika kuma laminates emhando yepamusoro emagetsi evatengi uye kutyaira kwega, jira re fiberglass rine dielectric shoma riri kupinda "munguva yekutariswa" isati yamboonekwa. Pakati penzvimbo yekudiwa kwezviwanikwa inozivikanwa nekukwira kwehuwandu, mitengo iri kuwedzera, uye kushomeka kwesimba, "jira remagetsi" iri rinoratidzika kunge rakareruka pasina mubvunzo rave rimwe rezvikamu zvinokura zvakanyanya zvinobatanidza zvivakwa zveAI hardware uye matekinoroji ekukurukurirana echizvarwa chinotevera.